Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
US9226401B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2013 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Jun 3, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers; first and second internal electrodes having first and second leads; and first and second external electrodes, wherein when lengths from edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to points at which the first or second external electrode contacts the first and second leads are G1, lengths from the edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to a corresponding end surface of the ceramic body are BW1, and lengths from the corresponding end surface of the ceramic body to points at which the first or second external electrode contacts the first and second leads are M1, 30 μm≦G1<BW1−M1 is satisfied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.