Strain isolation structures for stretchable electronics
US9226402B2 · kind B2 · utility
73Cited by
49References
34Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Feb 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.