High heat capacity electronic components and methods for fabricating
US9226428B2 · kind B2 · utility
4Cited by
24References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2012 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Jul 6, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus may include an electrical component body, where the electrical component body is operative to vary power during operation. The apparatus may also include a thermal component in contact with at least a portion of the electrical component body, in which the thermal component comprises a matrix material, and a thermal energy storage material embedded in the matrix material to absorb heat generated by the electrical component body. Other embodiments are disclosed and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.