Pressure sensor and manufacture method thereof
US9227832B1 · kind B1 · utility
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23Claims
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Key dates
| Filing date | Jan 14, 2015 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | Jan 14, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0264
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A pressure sensor using the MEMS element and the manufacture method thereof utilize the semiconductor processes to form the micro channel connecting to the chamber, open the micro channel, coat the anti-sticking layer on the inner surface of the chamber, and then seal the micro channel to keep the chamber airtight. Therefore, the manufacture method may essentially simplify the process to coat the anti-sticking layer on the inner surface of the airtight chamber to prevent the sticking and failing of the movable MEMS element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.