Method of electroplating silver strike over nickel
US9228268B2 · kind B2 · utility
1Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2011 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | Jul 24, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A silver electroplating solution is used to electroplate a mirror bright silver layer on a nickel or nickel alloy substrate. The silver electroplating solution is cyanide-free and environmentally friendly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.