Covering structure, input device, and manufacturing method of covering structure
US9229537B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2014 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | Jul 31, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24529
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A covering structure including a bottom covering layer, a top covering layer, and a thermoplastic material layer is disclosed. The thermoplastic material layer is laminated between the bottom covering layer and the top covering layer. The thermoplastic material layer includes a first thermoplastic material layer part and a second thermoplastic material layer part that are connected to each other. The first thermoplastic material layer part has a first thickness. The second thermoplastic material layer part has a second thickness. The first thickness is larger than the thickness of the top covering layer. The first thickness is 4˜7 times of the second thickness. The disclosure further discloses an input device using the covering structure and a manufacturing method of the covering structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.