Adhesive compound and method for encapsulating an electronic arrangement

US9230829B2 · kind B2 · utility

Assignee

• tesa SE · DE

Inventors

• Klaus Telgenbüscher · Hamburg, DE
• Judith Grünauer · Hamburg, DE
• Jan Ellinger · Hamburg, DE

Key dates

• Filing date: Nov 3, 2011
• Grant date: Jan 5, 2016
• Expiry date: Nov 3, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12044
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.