Patent · US Active

Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond pads

US9230852B2 · kind B2 · utility

0Cited by

1References

17Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Helmut Rinck · Moosburg an der Isar, DE
Fromund Metz · Marzling, DE
Jan Hermann Pape · Freising, DE
Janet Riley · Hideaway, US

Key dates

Filing date	Feb 25, 2013
Grant date	Jan 5, 2016
Priority date	—
Expiry date	Feb 25, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit (IC) die has a top side surface providing circuitry including active circuitry configured to provide a function, including at least one bond pad formed from a bond pad metal coupled to a node in the circuitry. A dielectric passivation layer is over a top side surface of a substrate providing a contact area which exposes the bond pad. A metal capping layer includes an electrically conductive metal or an electrically conductive metal compound over at least the contact area to provide corrosion protection to the bond pad metal, which is in electrical contact with the bond pad metal. The metal capping layer can extend over structures other than the bond pads, such as to cover at least 80% of the area of the IC die to provide structures on the IC die protection from incident radiation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.