Integrated circuit package for heat dissipation
US9230878B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2013 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | Mar 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83385
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for enclosing an electronic component to a base comprising, an enclosure attached to a base and surrounding an electronic component. The enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base. The second portion of the enclosure is attached to the base. The first portion of the enclosure is attached to the second portion of the enclosure. The enclosure including one or more extruding elements on an exterior surface of the enclosure. The one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.