Semiconductor device including alternating stepped semiconductor die stacks
US9230942B2 · kind B2 · utility
5Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2013 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | Feb 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including alternating stepped semiconductor die stacks to allow for large numbers of semiconductor die to be provided within a semiconductor device using short wire bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.