Light emitting diode package structure
US9231168B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2014 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | May 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8511
Abstract
A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.