Patent · US Active

Method for manufacturing an electronic module

US9232658B2 · kind B2 · utility

0Cited by

24References

14Claims

0Family size

Assignee

GE Embedded Electronics Oy · FI

Inventors

Antti Iihola · Helsinki, FI
Timo Jokela · Halikko, FI

Key dates

Filing date	Apr 2, 2010
Grant date	Jan 5, 2016
Priority date	—
Expiry date	Jul 14, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49156
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (1). At least one recess (2) is made in the sheet (1) and extends through the insulating-material layer (1) as far as the conductive layer on the opposite surface (1a). A component (6) is set in the recess, with its contact surface towards the conductive layer and the component (6) is attached to the conductive layer. After this, a conductive pattern (14) is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component (6) set in the recess.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.