Method for manufacturing photoaligning integrated large area metallic stamp, and method for manufacturing polymer optical device using same
US9233487B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2011 |
| Grant date | Jan 12, 2016 |
| Priority date | — |
| Expiry date | Oct 24, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The disclosure relates to a method for manufacturing a photoaligning integrated large area metallic stamp, which includes the following steps: making a unit device PLC mold pattern, and molding a unit PLC device pattern through a multistep imprinting method using the PLC mold pattern; heat treating the unit PLC device pattern to minimize scattering loss due to surface roughness; making a groove pattern for supporting an optical fiber; making an integrated PDMS mold for a unit device by aligning the unit PLC device pattern and the groove pattern; and repeatedly replicating the integrated PDMS mold for a unit device to make a large area PDMS pattern, and making a large area stamp through electroforming using the large area PDMS pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.