Patent · US Active

Adjustment mechanism of mold system having electrically adjusting and positioning functions

US9233496B2 · kind B2 · utility

0Cited by
8References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 25, 2012
Grant dateJan 12, 2016
Priority date
Expiry dateJan 11, 2034

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C45/2606
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A mold system includes a carrier platform and an adjustment mechanism. The carrier platform is provided to arrange at least one mold member. The adjustment mechanism includes at least two adjustment units arranged on the carrier platform. Each of the adjustment units includes a positioning member and an electrically-driven adjustment member pivotally-connected therewith. In adjustment operation, the positioning members commonly engage with the mold member and are driven by the electrically-driven adjustment members.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.