Production process for a micromechanical component and micromechanical component
US9233841B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2013 |
| Grant date | Jan 12, 2016 |
| Priority date | — |
| Expiry date | Dec 5, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0133
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A production process for a micromechanical component includes at least partially structuring at least one structure from at least one monocrystalline silicon layer by at least performing a crystal-orientation-dependent etching step on an upper side of the silicon layer with a given (110) surface orientation of the silicon layer. For the at least partial structuring of the at least one structure, at least one crystal-orientation-independent etching step is additionally performed on the upper side of the silicon layer with the given (110) surface orientation of the silicon layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.