Single-package bridge-type magnetic field sensor
US9234948B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2011 |
| Grant date | Jan 12, 2016 |
| Priority date | — |
| Expiry date | Apr 22, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R33/098
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A magnetoresistive sensor bridge utilizing magnetic tunnel junctions is disclosed. The magnetoresistive sensor bridge is composed of one or more magnetic tunnel junction sensor chips to provide a half-bridge or full bridge sensor in a standard semiconductor package. The sensor chips may be arranged such that the pinned layers of the different chips are mutually anti-parallel to each other in order to form a push-pull bridge structure. The sensor chips are then interconnected using wire bonding. The chips can be wire-bonded to various standard semiconductor leadframes and packaged in inexpensive standard semiconductor packages. The bridge design may be push-pull or referenced. In the referenced case, the on-chip reference resistors may be implemented without magnetic shielding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.