Automated control of semiconductor wafer manufacturing based on electrical test results
US9235413B1 · kind B1 · utility
1Cited by
3References
14Claims
0Family size
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Key dates
| Filing date | Aug 3, 2005 |
| Grant date | Jan 12, 2016 |
| Priority date | — |
| Expiry date | Mar 31, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
In semiconductor wafer manufacturing, processes such as analyzing test data associated with semiconductor wafers, interpreting the test data analysis, and acting on the test data interpretation and analysis are automated. Such automation can eliminate delays that were previously imposed by the action of test analysis engineers and wafer fabrication personnel, thereby reducing the amount of useless material that is produced before a process defect can be detected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.