Semiconductor device and method for manufacturing the same
US9236316B2 · kind B2 · utility
4Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2013 |
| Grant date | Jan 12, 2016 |
| Priority date | — |
| Expiry date | Mar 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention has a tray corresponding to a heat sink, a circuit part is accommodated in an accommodating part of the tray, and the circuit part is potting-sealed with a sealing resin such that external electrodes are exposed. The sealing resin covers and seals a top part of the tray.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.