Device housing package and electronic apparatus employing the same
US9237662B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 21, 2011 |
| Grant date | Jan 12, 2016 |
| Priority date | — |
| Expiry date | Apr 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48245
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device housing package includes a base body (1) including, at its upper surface, a placement portion (1a) of a semiconductor device (9); a frame body (2) disposed on the base body (1) surrounding the placement portion (1a), including a notch (2b) formed by cutting a side wall thereof; an input-output terminal (3) attached to the notch (2b), including a wiring conductor layer (3a) electrically connected to the semiconductor device (9); and a sealing ring (5) disposed on an upper portion of the frame body (2). Moreover, side walls of the frame body (2) have, when seen in a plan view, an outer corner (2c) of adjacent side walls having a curved surface, the outer corner (2c) lying within a region overlapping the sealing ring (5) as seen in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.