Lighting apparatus, LED mounting substrate and mold for manufacturing the same
US9238317B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Jan 16, 2014 |
| Grant date | Jan 19, 2016 |
| Priority date | — |
| Expiry date | Apr 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An LED mounting substrate includes a lead frame, a base, and a residue of injection molding material. The base is placed on the lead frame, and includes a cavity. The bottom of the cavity includes an opening for exposing portion of the lead frame. The cross-sectional area of the cavity increases along the direction from the lead frame to the top surface of the base. The residue of injection molding material is remained on one of outer walls of the base surrounding the cavity. The cross-sectional area of the residue of injection molding material decreases along the direction from the lead frame to the top surface of the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.