Hybrid adhesive and the use thereof in engineered wood boards

US9238767B2 · kind B2 · utility

Assignee

• Kronotec AG · CH

Inventors

• Roger Braun · Willisau, CH
• Andreas Gier · Melle, DE
• Joachim Hasch · Berlin, DE

Key dates

• Filing date: Oct 21, 2011
• Grant date: Jan 19, 2016
• Expiry date: Oct 21, 2031

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J177/06
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The present invention relates to a hybrid adhesive, in particular for use in the production of engineered wood such as particle boards, fiber boards, plywood or glued-laminated timber, comprising at least one polycondensation adhesive, at least one polyaddition adhesive, and at least one particular, in particular a nanoparticle smaller than 500 nm, wherein the at least one particle is modified with at least one compound of the general Formula (I) RaSiX(4-a), or the general Formula (II) ObXc(OH)dReSiO(4-b-c-d-e)/2. The present invention also relates to the use of the adhesive in engineered wood boards and to methods for the production thereof.