Adhesive varnish, adhesive film and wiring film
US9241404B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2014 |
| Grant date | Jan 19, 2016 |
| Priority date | — |
| Expiry date | Apr 13, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate and at least one of a vinyl group, an acrylate group and a methacrylate group, 5 to 30 parts by mass of a component C that includes a maleimide compound including a plurality of maleimide groups in a molecule thereof or/and a reaction product thereof, a component S1 including a low-boiling point solvent having a boiling point of not more than 100° C., and a component S2 including a high-boiling point solvent having a boiling point of more than 100° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.