Patent · US Active

Electronic assembly

US9241406B2 · kind B2 · utility

0Cited by

0References

9Claims

0Family size

Assignee

Au Optronics Corporation · TW

Inventors

Yan Fang · Fremont, US
Po-Fu Huang · Baoshan, TW
Chun-Ming Lin · Dashulong, TW

Key dates

Filing date	Jul 10, 2013
Grant date	Jan 19, 2016
Priority date	—
Expiry date	Jan 13, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10128
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An electronic assembly includes a first substrate, at least one first conductive pad and multiple second conductive pads. The first substrate comprises a base layer and at least one conductive circuit layer. The at least one conductive circuit layer is disposed on the base layer. The at least one first conductive pad is disposed on the first substrate. The first conductive pad is electrically insulated from the conductive circuit layer. The first conductive pad includes multiple first holes. The second conductive pads are disposed on the first substrate. The second conductive pads are electrically connected to the conductive circuit layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.