Electronic device housing and method for manufacturing the same
US9241435B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 10, 2012 |
| Grant date | Jan 19, 2016 |
| Priority date | — |
| Expiry date | Apr 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0999
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device housing includes a plastic substrate. The plastic substrate includes a first surface. The electronic device housing further includes an activating layer formed on the first surface. The activating layer contains metal powder. The activating layer defines a recessed portion. Some of the metal powder is partially exposed on the surface of the recessed portion. Some of metal powder is partially inserted into the plastic substrate corresponding to the recessed portion. The electronic device housing further includes an antenna layer formed on the recessed portion. The antenna layer is a metal layer. A method for manufacturing the electronic device housing is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.