Component mounting device, a component mounting method, an imaging device and an imaging method
US9241436B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2011 |
| Grant date | Jan 19, 2016 |
| Priority date | — |
| Expiry date | Sep 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0812
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A first illuminating devices, when the component adsorbed by an adsorbing nozzle and located in an imaging field of vision is a surface mounted component, illuminate the bottom surface of a component by irradiating light to the component obliquely from below, and a second illuminating device, when the component adsorbed by the adsorbing nozzle and located in the imaging field of vision is a through hole component, only illuminate the downwards extending parts of the component by irradiating light at an irradiation angle closer to a horizontal direction irradiation than the irradiation angle of the light of the first illuminating device to the component are included. That the component is illuminated by the first illuminating devices and that the component is illuminated by the second illuminating devices are switched based on whether the component is a surface mounted component or a through hole component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.