Method to stress relieve a magnetic recording head transducer utilizing ultrasonic cavitation
US9242340B1 · kind B1 · utility
1Cited by
170References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2013 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Nov 16, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/048
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Magnetic heads are fabricated by slicing and dicing wafers into row bars, which undergo frontside lapping and backside lapping. These lapping processes, as well as other processes, induce stresses on the row bars that are released prior to finalizing the magnetic head. Ultrasonic impact technology is used to release the stress in the row bars and to clean the row bars at the same time. Ultrasonic impact technology is used after the row bars have been wire bonded without having to de-bond the row bars.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.