Resin for thermal imprinting
US9242407B2 · kind B2 · utility
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Key dates
| Filing date | Aug 1, 2014 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Aug 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0108
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cyclic-olefin-based thermoplastic resin for thermal imprint to be used in the production of a sheet or a film which contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]<30. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.