Textured substrate for epitaxial film formation, and method for manufacturing the same
US9242433B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2013 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Mar 21, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1259
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a textured substrate for epitaxial film formation, comprising a textured metal layer at least on one side, wherein the textured metal layer includes a copper layer having a cube texture and a nickel layer having a thickness of 100 to 20000 nm formed on the copper layer; the nickel layer has a nickel oxide layer formed on a surface thereof, having a thickness of 1 to 30 nm, and including a nickel oxide; and the nickel layer further includes a palladium-containing region formed of palladium-containing nickel at an interface with the nickel oxide layer. The top layer of the textured substrate, i.e. the nickel oxide layer, has a surface roughness of preferably 10 nm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.