HMPSA for debondable self-adhesive label
US9242437B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2011 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Sep 3, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24934
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A hot-melt pressure-sensitive adhesive (HMPSA) composition comprising (a) 25 to 50% of one or more styrene block copolymers SBS, SIS, SIBS, SEBS or SEPS; (b) 35 to 75% of one or more compatible tackifying resins that are liquid or have a softening temperature below 150° C.; and (c) 1 to 20% of one or more supramolecular polymers obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone and a fatty acid composition comprising 51 to 100% of one or more dimers and/or trimers of fatty acids and 0 to 49% of one or more monomers of fatty acids. A multilayer system including the HMPSA, an adjacent printable support layer, made of paper or a polymer film, and a protective layer adjacent is also provided. The multilayer system may be used in a self-adhesive label.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.