Microchip with blocking apparatus
US9242856B2 · kind B2 · utility
1Cited by
16References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2014 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Apr 3, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/035
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microchip has a base die with a conductive interconnect and an isolation trench around at least a portion of the conductive interconnect, and a cap die secured to the base die. A seal, formed from a metal material, is positioned between the base die and the cap die to secure them together. The microchip also has a blocking apparatus, between the isolation trench and the metal seal, that at least in part prevents the metal material from contacting the interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.