Semiconductor photonic package
US9243784B2 · kind B2 · utility
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46References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2012 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Feb 22, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/424
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.