Cooling system for high density heat load
US9243823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2012 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Jun 10, 2033 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B7/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling cycle can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.