Micro-electro-mechanical sensing device and manufacturing method thereof
US9244093B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2012 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Dec 5, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0837
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micro-electro-mechanical sensing device including a substrate, a semiconductor layer, a supporting pillar, a first suspended arm, a connecting member, a second suspended arm, and a proof mass is provided. The semiconductor layer is disposed on or above the substrate. The supporting pillar is disposed on or above the semiconductor layer. The first suspended arm is disposed on the supporting pillar. The supporting connects a portion of the first suspended arm. The connecting member directly or indirectly connects another portion of the first suspended arm. The second suspended arm has a first surface and a second surface opposite to the first surface. The connecting member connects a portion of the first surface. The proof mass connects the second suspended arm and it includes a portion of the second suspended arm as a portion of the proof mass. A method for manufacturing the device is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.