Conductive film with doped layers, method for producing the same, and array substrate comprising the same
US9245661B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jun 24, 2014 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Jun 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A conductive film, a method for producing the same and an array substrate comprising the same are provided, so that copper atoms can be efficiently prevented from diffusing into an adjacent semiconductor layer or interlaminated insulation film. The conductive film comprises a base film made of copper or copper alloy, in which hydrogen and/or carbon atoms are distributed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.