High speed signal conditioning package
US9245828B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2013 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Jul 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package and integrated circuit assembly is configured to perform signal conditioning on a signal. The assembly includes a line card having line card contacts that correspond to conductors in the line card connector. Two or more integrated circuits are configured to perform signal conditioning on the signal and the two or more integrated circuits are configured within a package into at least a first row and a second row on the package. The package includes a grid array of bonding pads to electrically connect to the two or more integrated circuits through bond wires or down bonds such that the structure of the grid array corresponds in physical arrangement or bond pad pitch to the line card contacts. This assembly also includes an electrical connection from the two or more integrated circuits to the line card through the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.