Light emitting device
US9246074B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2013 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Jan 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device includes a plurality of light emitting elements, a plurality of lead frames, and a package. The light emitting elements are mounted on the lead frames. The package is made of resin. The package has an opening. A part of the lead frames is embedded in an inner portion of the package and another part of the lead frames is exposed on a bottom surface of the opening. A resin bottom surface on which the resin is exposed is provided on the bottom surface of the opening of the package. The package includes a wall portion projecting from the bottom surface of the opening between the light emitting elements in the opening. The light emitting elements are connected by wire that straddles the wall portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.