Lamination transfer films for forming articles with engineered voids
US9246134B2 · kind B2 · utility
17Cited by
11References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2014 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Feb 7, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24521
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Transfer films, articles made therewith, and methods of making and using transfer films to form bridged nanostructures are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.