High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB)
US9247647B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2014 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Sep 11, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package substrate (or printed circuit board) that includes at least one dielectric layer, a first inductor structure is at least partially located in the dielectric layer, a third interconnect, and a second inductor structure. The first inductor structure includes a first interconnect, a first via coupled to the first interconnect, and a second interconnect coupled to the first via. The third interconnect is coupled to the first inductor structure. The third interconnect is configured to provide an electrical path for a ground signal. The second inductor structure is at least partially located in the dielectric layer. The second inductor is coupled to the third interconnect. The second inductor structure includes a fourth interconnect, a second via coupled to the fourth interconnect, and a fifth interconnect coupled to the second via. The first and second inductor structures are configured to operate with a capacitor as a 3rd harmonic suppression filter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.