Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
US9247652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2008 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Nov 26, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.