Thermal transfer panels with channel structures and method of using thermal transfer panels
US9248492B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Sep 12, 2012 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Jan 21, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49629
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A panel system has an insulating material with a first channel disposed over a surface of the insulating material. A transporter is disposed over the first channel. A thermal transfer medium is disposed over the surface of the first panel to attain desired surface characteristics. The first panel includes a second channel intersecting the first channel. A second panel includes a second channel. The first panel is adjacent to the second panel. The first and second channels of the adjacent first and second panels are aligned. The transporter is disposed over the first and second channels. The first and second panels are mounted over a mounting surface. Keyways are formed in the channels. Retention clips are disposed over the keyways. Panels include panel wings with hinges mounted over the panel wings. The thermal transfer medium includes graphite. The transporter includes tubing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.