Copper powder for conductive paste and method for producing same
US9248504B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2011 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | May 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.