Build platform leveling and homing
US9248600B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2014 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | May 28, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y50/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A three-dimensional printer uses its extruder and build platform to properly orient the build platform within a working volume. In a multi-point leveling operation, the extruder is moved to the z-axis origin at a number of x-y positions within the plane of the build platform, and the height of the build platform is adjusted to meet the extruder at the origin. If the build platform is a meltable material such as a plastic, then this leveling process must be performed while the extruder is cool. A homing operation may be performed periodically after leveling in order to realign the z-axis positions of the build platform and extruder. A non-meltable contact point may be usefully provided so that homing can be performed while the extruder is hot, such as immediately before a build or between a number of builds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.