Self-repairing composition, self-repairing materials, self-repairing methods and applications
US9249237B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2009 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Jan 3, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L51/085
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a micro-encapsulated self-repairing polymerizable composition that comprises at least one selected polymerizable compound to be integrated into organic, inorganic or composite materials for the self-repairing of damages incurred in the use conditions thereof, characterized in that micro-encapsulated polymerizable composition is integrated alone into said materials and, after the release of the microcapsule and in the absence of a catalyst, spontaneously polymerizes in the presence of a polymerization-triggering agent that is absent in said materials but naturally occurs during the use thereof, thus repairing said damages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.