Terpolymer molding compounds with a low yellow index, method for producing same, and use thereof
US9249290B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2012 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Dec 28, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a thermoplastic molding compound containing: a) 50 to 85 parts of one or more terpolymers based on acrylnitril, alpha-methylstyrene, and styrene as component A, said terpolymers consisting of: 5 to 30 wt. % styrene, 15 to 35 wt. % acrylnitril, 50 to 70 wt. % alpha-methylstyrene, and 0 to 5 wt. % additional copolymerizable monomers, b) 15 to 50 parts of one or more impact-modifying graft rubbers with an olefinic double bond in the rubber phase as component B, c) 0 to 45 parts of one or more copolymers based on styrene and acrylnitril as component C, said copolymers consisting of: 71 to 81 wt. % styrene, 29 to 19 wt. % acrylnitril, and 0 to 5 wt. % additional copolymerizable monomers, and optionally additives and fibrous and/or particulate fillers. The thermoplastic molding compound leads to a reduced yellowing of the produced molded body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.