Resilient floor
US9249581B2 · kind B2 · utility
76Cited by
248References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 2014 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | May 8, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49623
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A method of assembling resilient floorboards is disclosed that includes the step of bending an edge of a floorboard during the assembling. The bending reduces the force required for connection of the edge to another edge of a juxtaposed floorboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.