Wiring substrate and method of manufacturing the same
US9252096B2 · kind B2 · utility
2Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2013 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Jun 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/029
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring substrate includes a core substrate including a first wiring layer, an interlayer insulating layer formed by a resin layer containing fiber reinforcement material formed on the core substrate and a primer layer formed on the resin layer containing fiber reinforcement material, and the interlayer insulating layer having a via hole reaching the first wiring layer, and a second wiring layer formed on the primer layer, and connected to the first wiring layer through the via hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.