Semiconductor package having a metal paint layer
US9252107B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2013 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Mar 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/526
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.