Semiconductor package
US9252112B2 · kind B2 · utility
3Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2014 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Sep 16, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/384
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a semiconductor package, including: a lower package to which elements are mounted; a metal post connected to the lower package and including at least one metal material portion; and an upper package to which elements is mounted, and which is connected to the metal post via a solder ball.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.