No-exposed-pad ball grid array (BGA) packaging structures and method for manufacturing the same
US9252113B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2014 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Apr 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A no-exposed-pad ball grid array (BGA) packaging structure includes a metal substrate, a first die coupled to a top surface of the metal substrate, and a plurality of outer leads formed on the metal substrate and extending to the proximity of the die. A metal layer that contains a plurality of inner leads corresponding to the plurality of outer leads and extending to the proximity of the die is formed on the metal substrate by a multi-layer electrical plating process such that a lead pitch of the plurality of inner leads is significantly reduced. Furthermore, the die and the plurality of inner leads are connected by metal wires, and a plurality of solder balls is attached to a back surface of the plurality of outer leads and a die pad. The die, the plurality of inner leads, and the metal wires are sealed with a molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.