Interconnect devices for electronic packaging assemblies
US9252138B2 · kind B2 · utility
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10References
16Claims
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Assignee
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Key dates
| Filing date | May 27, 2014 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | May 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic packaging assembly having a semiconductor integrated circuit and a plurality of interconnect components is provided. The plurality of interconnect components is operatively coupled to the semiconductor integrated circuit. Further, one or more interconnect components include one or more support elements having a first surface and a second surface, and one or more spring elements having a first end and a second end, and wherein first ends of the one or more spring elements are coupled to the first surface or the second surface of a respective support element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.